V.35,no.4,Dec 2023 https://doi.org/10.5764/TCF. Journal Textile Coloration and Finishing Year / Vol., Issue, Month 2016 / V.28,no.1,Mar Title Comparative Analysis of Heat Sink and Adhesion Properties of Thermal Conductive Particles for Sheet Adhesive Authors Yeong Su Kim, Sang Ha Park1, Jeong Woo Choi1, Lee Seong Kong1, Gwan Han Yun1, Byung Gil Min1 and Seung Han Lee2,* Institution/Affiliations Kumoh National Institute of Technology, kit Pages/Total page pp.48 ~ 56 / Language Korean Abstract Abstract Improvement of heat sink technology related to the continuous implementation performance and extension of device-life in circumstance of easy heating and more compact space has been becoming more important issue as multi-functional integration and miniaturization trend of electronic gadgets and products has been generalized. In this study, it purposed to minimize of decline of the heat diffusivity by gluing polymer through compounding of inorganic particles which have thermal conductive properties. We used NH-9300 as base resin and used inorganic fillers such as silicon carbide(SiC), aluminum nitride(AlN), and boron nitride(BN) to improve heat diffusivity. After making film which was made from 100 part of acrylic resin mixed hardener(1.0 part more or less) with inorganic particles. The film was matured at 80℃ for 24h. Diffusivity were tested according to sorts of particles and density of particles as well as size and structure of particle to improve the effect of heat sink in view of morphology assessing diffusivity by LFA(Netzsch/ LFA 447 Nano Flash) and adhesion strength by UTM(Universal Testing Machine). The correlation between diffusivity of pure inorganic particles and composite as well as the relation between density and morphology of inorganic particles has been studied. The study related morphology showed that globular type had superior diffusivity at low density of 25% but on the contarary globular type was inferior to non-globular type at high density of 80%. Keywords Keywords diffusivity, heat sink, thermal conductivity, adhesive, adhesion, inorganic composite, acrylic adhesive Download   Reference http://www.koreascience.or.kr/article/ArticleFullRecord.jsp?cn=OSGGBT_2016_v28n1_48&ordernum=6